htw saar Piktogramm QR-encoded URL
Back to Main Page Choose Module Version:
XML-Code

flag

Electronic Assembly and Surface-Mounting Technology

Module name (EN):
Name of module in study programme. It should be precise and clear.
Electronic Assembly and Surface-Mounting Technology
Degree programme:
Study Programme with validity of corresponding study regulations containing this module.
Electrical Engineering, Bachelor, ASPO 01.10.2005
Module code: E519
Hours per semester week / Teaching method:
The count of hours per week is a combination of lecture (V for German Vorlesung), exercise (U for Übung), practice (P) oder project (PA). For example a course of the form 2V+2U has 2 hours of lecture and 2 hours of exercise per week.
2V (2 hours per week)
ECTS credits:
European Credit Transfer System. Points for successful completion of a course. Each ECTS point represents a workload of 30 hours.
2
Semester: 5
Mandatory course: yes
Language of instruction:
German
Assessment:
Written examination

[updated 12.03.2010]
Applicability / Curricular relevance:
All study programs (with year of the version of study regulations) containing the course.

E519. Biomedical Engineering, Bachelor, ASPO 01.10.2011 , semester 5, optional course, course inactive since 28.11.2013
E519 Electrical Engineering, Bachelor, ASPO 01.10.2005 , semester 5, mandatory course
Workload:
Workload of student for successfully completing the course. Each ECTS credit represents 30 working hours. These are the combined effort of face-to-face time, post-processing the subject of the lecture, exercises and preparation for the exam.

The total workload is distributed on the semester (01.04.-30.09. during the summer term, 01.10.-31.03. during the winter term).
30 class hours (= 22.5 clock hours) over a 15-week period.
The total student study time is 60 hours (equivalent to 2 ECTS credits).
There are therefore 37.5 hours available for class preparation and follow-up work and exam preparation.
Recommended prerequisites (modules):
None.
Recommended as prerequisite for:
Module coordinator:
Prof. Dr. Volker Schmitt
Lecturer:
Prof. Dr. Volker Schmitt


[updated 12.03.2010]
Learning outcomes:
By acquiring a basic understanding of current technological practices used in the manufacture of electronic components, assemblies and systems students will be able to select appropriate techniques and assess their deployment. After completing this course, students will appreciate the importance and relevance of electronics packaging, PCB assembly and manufacturing aspects.

[updated 12.03.2010]
Module content:
- Interconnection, packaging and surface-mounted technologies; area requirements;
  hybrid circuits, surface-mounted PCB technology
- SMT component and packaging design, nomenclature, resistors, capacitors,  
  inductors, discrete semiconductors, integrated circuits, packaging and product  
  presentation, solderability and storage
- PCB design for SMDs, circuit diagram creation, monitoring points, rules, design
  variants, post-processing, inspection and testing, reduction of electromagnetic
  emissions and sensitivity
- Multilayer PCBs, laminates, prepregs, presses
- Pick-and-place techniques
- Soldering paste, properties, flux, activator, soldering quality, storage,  
  soldering techniques, adhesive bonding of SMDs to circuit boards
- Chip assembly, wire bond method, bonding faults, wire bond testing, superfine
  wires, gap welding, die bonding, eutectic alloying, adhesive bonding,  
  flip-chips, COB (chip-on-board), TAB (tape automated bonding), MCM (multichip
  module)
- Quality and reliability, failure rate, MTTF and MTBF

[updated 12.03.2010]
Teaching methods/Media:
Overhead transparencies, master copies for photocopying

[updated 12.03.2010]
Recommended or required reading:
R. Strauss: SMD Oberflächenmontierte Bauteile; VTT-Verlag für technische Texte
Nolde: SMD-Technik; Franzis Verlag
R. Krups: SMT-Handbuch; Vogel Verlag
H. Reichl: Hybridintegration; Hüthig Verlag
M. Huschka: Einführung in die Multilayer-Preßtechnik; Eugen G. Lenze Verlag
VDE/VDI (GMM): Schulungsblätter für die Leiterplattenfertigung [Educational training notes on PCB assembly (in German)]; Frankfurt a.M., 1999

[updated 12.03.2010]
 
[Sun Nov 24 13:37:47 CET 2024, CKEY=eauv, BKEY=e, CID=E519, LANGUAGE=en, DATE=24.11.2024]